M.L. Tounsi,∗ R. Touhami,∗ and M.C.E. Yagoub∗∗
Dynamic analysis, electromagnetic field, integrated circuit, metal- lization thickness, numerical methods, spectral domain approach
In this paper, the dynamic spectral domain approach is generalized to efficiently describe the dispersion properties of planar microwave circuits by considering any arbitrary metallization thickness and finite conductivity in multilayer configuration. The influence of finite metallization thickness on the frequency-dependent modal propagation characteristics is demonstrated for both single and coupled structures and can, for the first time, be easily extended to any multilayered circuit. The phase constant and the effective permittivity with finite strip thickness and finite conductivity are discussed for hybrid and monolithic circuits. Numerical results are presented and the CPU time is investigated.
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